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PCBA互聯(lián)密度發(fā)展時(shí)間軸:
成熟的POP(Package on Package,疊層封裝技術(shù)/堆疊封裝技術(shù))
POP應(yīng)用場景:
Bumping process flow-FOC Printing
凸點(diǎn)工藝流程-FOC印刷
REPSV Printing Bump Process Flow
凸點(diǎn)印刷工藝流程
Plating Process – FOC Flow
電鍍工藝-FOC流程
REPSV Plating Process Flow
電鍍工藝流程
PI RePSV
Plated RDL Process Flow(1/2)
RDL鍍覆工藝流程
Printed RDL Process Flow
RDL印刷工藝流程
BP-WLCSP Process Flow
BP-WLCSP工藝流程
Au RDL Process Flow (BCB1+Au Trace+BCB2)(for DRAM device)
金RDL工藝流程(BCB1+微量金+BCB2)(適用于動(dòng)態(tài)隨機(jī)存儲(chǔ)記憶體設(shè)備)
Au RDL Process Flow (Au Trace + PI) (for Flash device)
Au RDL工藝流程(金跡+PI)(適用于閃存設(shè)備)